基本信息:
- 专利标题： WAFER POLISHING DEVICE
- 申请号：US17578464 申请日：2022-01-19
- 公开(公告)号：US20230122191A1 公开(公告)日：2023-04-20
- 发明人： Yaomin Deng , Yuansi YANG
- 申请人： HANGZHOU SIZONE ELECTRONIC TECHNOLOGY INC.
- 申请人地址： CN Zhejiang
- 专利权人： HANGZHOU SIZONE ELECTRONIC TECHNOLOGY INC.
- 当前专利权人： HANGZHOU SIZONE ELECTRONIC TECHNOLOGY INC.
- 当前专利权人地址： CN Zhejiang
- 优先权： CN202111218264.0 20211020
- 主分类号： B24B37/34
- IPC分类号： B24B37/34 ; B24B37/005 ; B24B37/27 ; H01L21/304
摘要：
The present invention discloses a wafer polishing device, which comprises a second pressure medium cavity for detecting pressure changes; a porous disc with a plurality of through holes, and its lower surface is covered with a flexible single cavity film; a conduction valve unit for conduction or isolation between the second pressure medium cavity and the third pressure medium cavity, which at least includes a conduction valve seat, a conduction valve and an elastic part. The lower end of the conduction valve seat extends into the through hole, and protrudes from the lower end face of the conduction valve seat; The conduction valve seat, the porous disc and the covered flexible single cavity membrane combined to form the third pressure medium cavity; a first pressure medium cavity.
公开/授权文献:
- US11794304B2 Wafer polishing device 公开/授权日：2023-10-24
IPC结构图谱:
| B | 作业；运输 |
| --B24 | 磨削；抛光 |
| ----B24B | 用于磨削或抛光的机床、装置或工艺；磨具磨损表面的修理或调节；磨削，抛光剂或研磨剂的进给 |
| ------B24B37/00 | 研磨机床或装置，即需要在相对软但仍为刚性的研具和被研磨表面之间加入粉末状磨料；及其附件 |
| --------B24B37/34 | .附件 |