基本信息:
- 专利标题： MOLDED SENSOR ASSEMBLY
- 申请号：US17934132 申请日：2022-09-21
- 公开(公告)号：US20230096042A1 公开(公告)日：2023-03-30
- 发明人： Rick Russell , Jonathan Cheney , Scott Brown , Luca Salmaso , Aaron Hopkinson
- 申请人： Merit Medical Systems, Inc.
- 申请人地址： US UT South Jordan
- 专利权人： Merit Medical Systems, Inc.
- 当前专利权人： Merit Medical Systems, Inc.
- 当前专利权人地址： US UT South Jordan
- 主分类号： G01K1/08
- IPC分类号： G01K1/08
摘要：
A molded sensor assembly for measuring parameters in a given circumstance. The molded sensor assembly includes a housing with one or more apertures that extends from an upper surface to a lower surface of the housing. A lower surface of the housing is coupled to an upper surface of a printed circuit board member. A sensor is disposed within the housing, the sensor comprising wires that are coupled to the printed circuit board member. Each wire extends through an aperture of the housing.
IPC结构图谱:
| G | 物理 |
| --G01 | 测量；测试 |
| ----G01K | 温度测量；热量测量；未列入其他类目的热敏元件 |
| ------G01K1/00 | 非专用于特殊类型温度计的零部件 |
| --------G01K1/08 | .保护装置，例如，外壳 |