基本信息:
- 专利标题： CONFORMAL POWER DELIVERY STRUCTURES NEAR HIGH-SPEED SIGNAL TRACES
- 申请号：US17484299 申请日：2021-09-24
- 公开(公告)号：US20230094979A1 公开(公告)日：2023-03-30
- 发明人： Aleksandar Aleksov , Henning Braunisch , Feras Eid , Adel Elsherbini , Stephen Morein , Yoshihiro Tomita , Thomas L. Sounart , Johanna Swan , Brandon M. Rawlings
- 申请人： Intel Corporation
- 申请人地址： US CA Santa Clara
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： US CA Santa Clara
- 主分类号： H01L23/50
- IPC分类号： H01L23/50 ; H01L23/532
摘要：
Technologies for conformal power delivery structures near high-speed signal traces are disclosed. In one embodiment, a dielectric layer may be used to keep a power delivery structure spaced apart from high-speed signal traces, preventing deterioration of signals on the high-speed signal traces due to capacitive coupling to the power delivery structure.
IPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L23/00 | 半导体或其他固态器件的零部件 |
| --------H01L23/34 | .冷却装置；加热装置；通风装置或温度补偿装置 |
| ----------H01L23/50 | ..用于集成电路器件的 |