
基本信息:
- 专利标题: ELECTRONIC DEVICE INCLUDING HOUSING
- 申请号:US17861387 申请日:2022-07-11
- 公开(公告)号:US20230090870A1 公开(公告)日:2023-03-23
- 发明人: Youngjong SHIN , Hangyu HWANG , Changsu KIM , Hyeonwoo LEE , Sungho CHO , Jeonga KANG , Hyunsuk CHOI
- 申请人: Samsung Electronics Co., Ltd.
- 申请人地址: KR Gyeonggi-do
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人地址: KR Gyeonggi-do
- 优先权: KR10-2021-0125613 20210923
- 主分类号: H05K5/02
- IPC分类号: H05K5/02 ; H05K5/00 ; G02B3/00 ; G02B5/04
摘要:
According to an embodiment of the disclosure, an electronic device may include a housing including a rear plate including a first region having a first concavo-convex pattern formed therein, and a second region having a second concavo-convex pattern formed therein, and a processor disposed inside the housing. The first concavo-convex pattern and the second concavo-convex pattern may be integrally formed with the rear plate, and a first depth of the first concavo-convex pattern may be different from a second depth of the second concavo-convex pattern.
公开/授权文献:
- US12035489B2 Electronic device including housing 公开/授权日:2024-07-09
IPC结构图谱:
H | 电学 |
--H05 | 其他类目不包含的电技术 |
----H05K | 印刷电路;电设备的外壳或结构零部件;电气元件组件的制造 |
------H05K5/00 | 用于电设备的机壳、箱柜或拉屉 |
--------H05K5/02 | .零部件 |