基本信息:
- 专利标题： ELECTRONIC DEVICE INCLUDING HOUSING
- 申请号：US17861387 申请日：2022-07-11
- 公开(公告)号：US20230090870A1 公开(公告)日：2023-03-23
- 发明人： Youngjong SHIN , Hangyu HWANG , Changsu KIM , Hyeonwoo LEE , Sungho CHO , Jeonga KANG , Hyunsuk CHOI
- 申请人： Samsung Electronics Co., Ltd.
- 申请人地址： KR Gyeonggi-do
- 专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人地址： KR Gyeonggi-do
- 优先权： KR10-2021-0125613 20210923
- 主分类号： H05K5/02
- IPC分类号： H05K5/02 ; H05K5/00 ; G02B3/00 ; G02B5/04
摘要：
According to an embodiment of the disclosure, an electronic device may include a housing including a rear plate including a first region having a first concavo-convex pattern formed therein, and a second region having a second concavo-convex pattern formed therein, and a processor disposed inside the housing. The first concavo-convex pattern and the second concavo-convex pattern may be integrally formed with the rear plate, and a first depth of the first concavo-convex pattern may be different from a second depth of the second concavo-convex pattern.
公开/授权文献:
- US12035489B2 Electronic device including housing 公开/授权日：2024-07-09
IPC结构图谱:
| H | 电学 |
| --H05 | 其他类目不包含的电技术 |
| ----H05K | 印刷电路；电设备的外壳或结构零部件；电气元件组件的制造 |
| ------H05K5/00 | 用于电设备的机壳、箱柜或拉屉 |
| --------H05K5/02 | .零部件 |