基本信息:
- 专利标题： METHOD OF USING PROCESSING OVEN
- 申请号：US17872320 申请日：2022-07-25
- 公开(公告)号：US20230060603A1 公开(公告)日：2023-03-02
- 发明人： Lei Jing , M Ziaul Karim , Kenneth Sautter , Kang Song
- 申请人： Yield Engineering Systems, Inc.
- 申请人地址： US CA Fremont
- 专利权人： Yield Engineering Systems, Inc.
- 当前专利权人： Yield Engineering Systems, Inc.
- 当前专利权人地址： US CA Fremont
- 主分类号： B23K1/015
- IPC分类号： B23K1/015 ; H01L23/00 ; B23K1/008 ; B23K3/08
摘要：
A method of using a processing oven may include disposing at least one substrate in a chamber of the oven and activating a lamp assembly disposed above them to increase their temperature to a first temperature. A chemical vapor may be admitted into the chamber above the at least one substrate and an inert gas may be admitted into the chamber below the at least one substrate. The temperature of the at least one substrate may then be increased to a second temperature higher than the first temperature and then cooled down.
公开/授权文献:
- US11850672B2 Method of using processing oven 公开/授权日：2023-12-26
IPC结构图谱:
| B | 作业；运输 |
| --B23 | 机床；不包含在其他类目中的金属加工 |
| ----B23K | 钎焊或脱焊；焊接；用钎焊或焊接方法包覆或镀敷；局部加热切割，如火焰切割；用激光束加工 |
| ------B23K1/00 | 钎焊，如硬钎焊或脱焊 |
| --------B23K1/012 | .应用热气体钎焊 |
| ----------B23K1/015 | ..蒸气—沉积钎焊 |