基本信息:
- 专利标题： SEMICONDUCTOR PACKAGE
- 申请号：US17983018 申请日：2022-11-08
- 公开(公告)号：US20230055812A1 公开(公告)日：2023-02-23
- 发明人： YUN SEOK CHOI
- 申请人： SAMSUNG ELECTRONICS CO., LTD.
- 申请人地址： KR SUWON-SI, GYEONGGI-DO
- 专利权人： SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人： SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人地址： KR SUWON-SI, GYEONGGI-DO
- 优先权： KR10-2020-0025383 20200228
- 主分类号： H01L25/065
- IPC分类号： H01L25/065 ; H01L23/538 ; H01L23/367 ; H01L23/31 ; H01L23/48
摘要：
A semiconductor package includes an upper substrate having a first surface and a second surface which are opposite to each other, a lower semiconductor chip disposed on the first surface of the upper substrate, a plurality of conductive pillars disposed on the first surface of the upper substrate at at least one side of the lower semiconductor chip, and an upper semiconductor chip disposed on the second surface of the upper substrate. The lower semiconductor chip and the plurality of conductive pillars are connected to the first surface of the upper substrate, and the upper semiconductor chip is connected to the second surface of the upper substrate.
公开/授权文献:
- US12002784B2 Semiconductor package 公开/授权日：2024-06-04
IPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L25/00 | 由多个单个半导体或其他固态器件组成的组装件 |
| --------H01L25/03 | .所有包含在H01L27/00至H01L51/00各组中同一小组内的相同类型的器件，例如整流二极管的组装件 |
| ----------H01L25/04 | ..不具有单独容器的器件 |
| ------------H01L25/065 | ...包含在H01L27/00组类型的器件 |