
基本信息:
- 专利标题: SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
- 申请号:US17787982 申请日:2020-12-28
- 公开(公告)号:US20230027402A1 公开(公告)日:2023-01-26
- 发明人: Shunpei YAMAZAKI , Shinya SASAGAWA , Ryota HODO , Tomoaki MORIWAKA
- 申请人: Semiconductor Energy Laboratory Co., Ltd.
- 申请人地址: JP Atsugi-shi, Kanagawa-ken
- 专利权人: Semiconductor Energy Laboratory Co., Ltd.
- 当前专利权人: Semiconductor Energy Laboratory Co., Ltd.
- 当前专利权人地址: JP Atsugi-shi, Kanagawa-ken
- 优先权: JP2020-002997 20200110
- 国际申请: PCT/IB2020/062468 WO 20201228
- 主分类号: H01L29/66
- IPC分类号: H01L29/66 ; H01L21/02 ; H01L21/8239
摘要:
A semiconductor device with a small variation in characteristics is provided. The semiconductor device includes a first insulator; a second insulator having an opening over the first insulator; a third insulator that has a first depressed portion and is provided inside the opening; a first oxide that has a second depressed portion and is provided inside the first depressed portion; a second oxide provided inside the second depressed portion; a first conductor and a second conductor that are electrically connected to the second oxide and are apart from each other; a fourth insulator over the second oxide; and a third conductor including a region overlapping with the second oxide with the fourth insulator therebetween. The second oxide includes a first region, a second region, and a third region sandwiched between the first region and the second region in a top view. The first conductor includes a region overlapping with the first region and the second insulator. The second conductor includes a region overlapping with the second region and the second insulator. The third conductor includes a region overlapping with the third region.