基本信息:
- 专利标题： Structure with Conductive Pattern and Method for Manufacturing Same
- 申请号：US17770303 申请日：2020-11-05
- 公开(公告)号：US20220408558A1 公开(公告)日：2022-12-22
- 发明人： Tomoko Kozono , Toru Yumoto
- 申请人： Asahi Kasei Kabushiki Kaisha
- 申请人地址： JP Tokyo
- 专利权人： Asahi Kasei Kabushiki Kaisha
- 当前专利权人： Asahi Kasei Kabushiki Kaisha
- 当前专利权人地址： JP Tokyo
- 优先权： JP2019-203276 20191108
- 国际申请： PCT/JP2020/041415 WO 20201105
- 主分类号： H05K1/09
- IPC分类号： H05K1/09 ; H05K3/10 ; H05K1/02 ; H01Q1/38 ; C23C18/40 ; C23C18/18 ; C23C18/16
摘要：
Provided are: a structure with a conductive pattern that can be obtained in a simple manufacturing process and that exhibits favorable interlayer adhesion; and a method for manufacturing same. An embodiment of the present invention provides a structure with a conductive pattern, the structure comprising a base material, and a copper-containing conductive layer arranged on the surface of the base material, wherein when a principal surface of the conductive layer on the side facing the base material is a first principal surface, and a principal surface of the conductive layer on the opposite side from the first principal surface is a second principal surface, the conductive layer: has a porosity of 0.01 to 50 volume percent in a first principal surface-side region that extends from the first principal surface to a depth of 100 nm in the thickness direction of the conductive layer.
IPC结构图谱:
| H | 电学 |
| --H05 | 其他类目不包含的电技术 |
| ----H05K | 印刷电路；电设备的外壳或结构零部件；电气元件组件的制造 |
| ------H05K1/00 | 印刷电路 |
| --------H05K1/02 | .零部件 |
| ----------H05K1/09 | ..金属图形材料的应用 |