基本信息:
- 专利标题： PHOTONIC INTEGRATED CIRCUIT (PIC) PACKAGE
- 申请号：US17763381 申请日：2020-09-24
- 公开(公告)号：US20220365296A1 公开(公告)日：2022-11-17
- 发明人： Pavel Mamyshev
- 申请人： IPG PHOTONICS CORPORATION
- 申请人地址： US MA OXFORD
- 专利权人： IPG PHOTONICS CORPORATION
- 当前专利权人： IPG PHOTONICS CORPORATION
- 当前专利权人地址： US MA OXFORD
- 国际申请： PCT/US20/52377 WO 20200924
- 主分类号： G02B6/42
- IPC分类号： G02B6/42
摘要：
A method and system for an optical package assembly is disclosed. According to one example, the optical package assembly includes a photonic integrated circuit (PIC) chip, at least one fiber coupled to the PIC chip, a fiber lid plate disposed on at least a portion of the at least one fiber, and a cover plate having a surface coupled to the PIC chip and the fiber lid plate.
公开/授权文献:
- US12025841B2 Photonic integrated circuit (PIC) package 公开/授权日：2024-07-02
IPC结构图谱:
| G | 物理 |
| --G02 | 光学 |
| ----G02B | 光学元件、系统或仪器 |
| ------G02B6/00 | 光导；包含光导和其他光学元件（如耦合器）的装置的结构零部件 |
| --------G02B6/02 | .带有包层的光导纤维 |
| ----------G02B6/42 | ..光波导与光电元件的耦合 |