发明申请
US20220360246A1 TRANSVERSELY-EXCITED FILM BULK ACOUSTIC RESONATOR FABRICATION USING A PIEZOELECTRIC PLATE, SILICON SUBSTRATE AND HANDLE WAFER SANDWICH
有权

基本信息:
- 专利标题: TRANSVERSELY-EXCITED FILM BULK ACOUSTIC RESONATOR FABRICATION USING A PIEZOELECTRIC PLATE, SILICON SUBSTRATE AND HANDLE WAFER SANDWICH
- 申请号:US17565271 申请日:2021-12-29
- 公开(公告)号:US20220360246A1 公开(公告)日:2022-11-10
- 发明人: Kuan Zhang , Andrew Kay , Albert Cardona , Chris O'Brien
- 申请人: Resonant Inc.
- 申请人地址: US TX Austin
- 专利权人: Resonant Inc.
- 当前专利权人: Resonant Inc.
- 当前专利权人地址: US TX Austin
- 主分类号: H03H9/02
- IPC分类号: H03H9/02 ; H03H3/04 ; H03H9/13 ; H03H9/17
摘要:
An acoustic resonator device is formed that reduces a thermal coefficient of expansion mismatch between a piezoelectric plate and a silicon substrate by bonding the front surface of the silicon substrate having a filled and planarized sacrificial tub to a piezoelectric substrate and thinning the silicon substrate by removing material from a back surface. That back surface is then bonded to a handle wafer having a thermal coefficient of expansion (TCE) closer to a TCE of the piezoelectric substrate than a TCE of the silicon substrate and thinning the piezoelectric substrate to a target piezoelectric membrane thickness to form a piezoelectric plate. A conductor pattern is formed on the thinned piezoelectric plate and the sacrificial tub is removed to form a cavity and release a membrane of the piezoelectric plate using an etchant introduced through holes in the piezoelectric plate.
IPC结构图谱:
H | 电学 |
--H03 | 基本电子电路 |
----H03H | 阻抗网络,例如谐振电路;谐振器 |
------H03H9/00 | 包括机电或电声元件的网络,如谐振电路 |
--------H03H9/02 | .零部件 |