![MICRO SPECTRUM CHIP BASED ON UNITS OF DIFFERENT SHAPES](/abs-image/US/2022/10/27/US20220344381A1/abs.jpg.150x150.jpg)
基本信息:
- 专利标题: MICRO SPECTRUM CHIP BASED ON UNITS OF DIFFERENT SHAPES
- 申请号:US17423414 申请日:2020-10-12
- 公开(公告)号:US20220344381A1 公开(公告)日:2022-10-27
- 发明人: Kaiyu Cui , Jiawei Yang , Yidong Huang , Wei Zhang , Xue Feng , Fang Liu
- 申请人: Tsinghua University
- 申请人地址: CN Beijing
- 专利权人: Tsinghua University
- 当前专利权人: Tsinghua University
- 当前专利权人地址: CN Beijing
- 优先权: CN202010821286.5 20200814
- 国际申请: PCT/CN2020/120409 WO 20201012
- 主分类号: H01L27/146
- IPC分类号: H01L27/146
摘要:
A micro spectrum chip based on units of different shapes. The micro spectrum chip includes a CIS wafer and an optical modulation layer. The optical modulation layer includes several micro-nano structure units arranged on the surface of a photosensitive area of the CIS wafer. Each micro-nano structure unit includes a plurality of micro-nano structure arrays, and in each micro-nano structure unit, different micro-nano structure arrays are two-dimensional gratings composed of internal units of different shapes. In each micro-nano structure unit in this scheme, different micro-nano structure arrays have different shapes of internal units, and each group of micro-nano structure arrays have different modulation effects on lights with different wavelengths. The degree of freedom of “shape” is fully utilized to obtain a rich modulation effect on the incident light. A two-dimensional grating structure based on internal units of different shapes is utilized.
IPC结构图谱:
H | 电学 |
--H01 | 基本电气元件 |
----H01L | 半导体器件;其他类目未包含的电固体器件 |
------H01L27/00 | 由在一个共用衬底内或其上形成的多个半导体或其他固态组件组成的器件 |
--------H01L27/02 | .包括有专门适用于整流、振荡、放大或切换的半导体组件并且至少有一个电位跃变势垒或者表面势垒的;包括至少有一个跃变势垒或者表面势垒的无源集成电路单元的 |
----------H01L27/144 | ..由辐射控制的器件 |
------------H01L27/146 | ...图像结构 |