发明申请
US20220302079A1 Tools and Systems for Processing Semiconductor Devices, and Methods of Processing Semiconductor Devices
有权
基本信息:
- 专利标题： Tools and Systems for Processing Semiconductor Devices, and Methods of Processing Semiconductor Devices
- 申请号：US17833262 申请日：2022-06-06
- 公开(公告)号：US20220302079A1 公开(公告)日：2022-09-22
- 发明人： Kuei-Wei Huang , Hsiu-Jen Lin , Ai-Tee Ang , Ming-Da Cheng , Chung-Shi Liu
- 申请人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 申请人地址： TW Hsinchu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsinchu
- 主分类号： H01L23/00
- IPC分类号： H01L23/00
摘要：
Tools and systems for processing semiconductor devices, and methods of processing semiconductor devices are disclosed. In some embodiments, a method of using a tool for processing semiconductor devices includes a tool with a second material disposed over a first material, and a plurality of apertures disposed within the first material and the second material. The second material comprises a higher reflectivity than the first material. Each of the apertures is adapted to retain a package component over a support during an exposure to energy.
公开/授权文献:
IPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L23/00 | 半导体或其他固态器件的零部件 |