发明申请
US20220282132A1 ADHESIVE COMPOSITIONS, ARTICLES INCLUDING THE ADHESIVE COMPOSITIONS, AND METHODS THEREOF
有权

基本信息:
- 专利标题: ADHESIVE COMPOSITIONS, ARTICLES INCLUDING THE ADHESIVE COMPOSITIONS, AND METHODS THEREOF
- 申请号:US17748099 申请日:2022-05-19
- 公开(公告)号:US20220282132A1 公开(公告)日:2022-09-08
- 发明人: Mark S. Pucci , Paul D. Whaley , Michael Lloyd Opacich
- 申请人: MSI TECHNOLOGY LLC
- 申请人地址: US IL Arlington Heights
- 专利权人: MSI TECHNOLOGY LLC
- 当前专利权人: MSI TECHNOLOGY LLC
- 当前专利权人地址: US IL Arlington Heights
- 主分类号: C09J123/16
- IPC分类号: C09J123/16 ; C09J123/26 ; C08L23/04 ; C09J123/06 ; B32B7/12 ; B32B27/08 ; B32B27/32
摘要:
The teachings herein are directed at multi-layer films, tie layer compositions for multi-layer films and related methods, and to polymeric adhesive compositions and methods for manufacturing polymeric adhesive compositions. The tie layer composition preferably adhere to polypropylene, and more preferably adheres to both polyethylene and polypropylene. The tie layer preferably includes a propylene based elastomer. The tie layer includes one or more thermoplastic polyolefins. The tie layer composition may include a grafted polyolefin, e.g., having one or more functional grafts. The polymeric adhesive compositions preferably adhere to both polypropylene surfaces and to polyethylene surfaces. The polymeric adhesive composition preferably comprises a minority amount (i.e., less than about 40 weight percent) of a propylene based elastomer polymer and a majority amount (i.e., greater than about 55 weight percent) of an ethylene containing polymer. Preferred methods for manufacturing the polymeric adhesive composition avoids thermal processing (e.g., a cycle of heating above the melting temperature and cooling below the crystallization temperature) of at least a portion (or even all) of the ethylene containing polymer after removing from a polymerization reactor and before compounding with the propylene based elastomer.