发明申请
US20220278005A1 Precision Structured Glass Articles, integrated circuit packages, optical devices, microfluidic devices, and Methods for Making the Same
有权
基本信息:
- 专利标题： Precision Structured Glass Articles, integrated circuit packages, optical devices, microfluidic devices, and Methods for Making the Same
- 申请号：US17743643 申请日：2022-05-13
- 公开(公告)号：US20220278005A1 公开(公告)日：2022-09-01
- 发明人： Heather Debra Boek , Paul Bennett Dohn , Jin Su Kim , Aize Li , Hugh Michael McMahon , Jun-Ro Yoon
- 申请人： CORNING INCORPORATED
- 申请人地址： US NY Corning
- 专利权人： CORNING INCORPORATED
- 当前专利权人： CORNING INCORPORATED
- 当前专利权人地址： US NY Corning
- 主分类号： H01L23/13
- IPC分类号： H01L23/13 ; B32B17/06 ; B81B1/00 ; C03C3/087 ; C03C3/091 ; C03C3/093 ; C03C3/097 ; C03C15/00 ; H01L21/48 ; H01L23/15 ; H01L23/498
摘要：
The present disclosure relates to a reconstituted wafer- and/or panel-level package comprising a glass substrate having a plurality of cavities. Each cavity is configured to hold a single IC chip. The reconstituted wafer- and/or panel-level package can be used in a fan-out wafer or panel level packaging process. The glass substrate can include at least two layers having different photosensitivities with one layer being sufficiently photosensitive to be capable of being photomachined to form the cavities.
公开/授权文献:
IPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L23/00 | 半导体或其他固态器件的零部件 |
| --------H01L23/02 | .容器；封接 |
| ----------H01L23/13 | ..按形状特点进行区分的 |