发明申请
US20220157520A1 COMPOUND FOR BONDED MAGNET, BONDED MAGNET, METHOD OF PRODUCING SAME, AND RESIN COMPOSITION FOR BONDED MAGNETS
有权
![COMPOUND FOR BONDED MAGNET, BONDED MAGNET, METHOD OF PRODUCING SAME, AND RESIN COMPOSITION FOR BONDED MAGNETS](/abs-image/US/2022/05/19/US20220157520A1/abs.jpg.150x150.jpg)
基本信息:
- 专利标题: COMPOUND FOR BONDED MAGNET, BONDED MAGNET, METHOD OF PRODUCING SAME, AND RESIN COMPOSITION FOR BONDED MAGNETS
- 申请号:US17455155 申请日:2021-11-16
- 公开(公告)号:US20220157520A1 公开(公告)日:2022-05-19
- 发明人: Satoshi YAMANAKA , Takayuki YANO , Shuichi TADA , Masahiro ABE , Kenta IWAI
- 申请人: NICHIA CORPORATION
- 申请人地址: JP Anan-shi
- 专利权人: NICHIA CORPORATION
- 当前专利权人: NICHIA CORPORATION
- 当前专利权人地址: JP Anan-shi
- 优先权: JP2020-191743 20201118,JP2020-192544 20201119,JP2020-201165 20201203,JP2021-008210 20210121,JP2021-008211 20210121,JP2021-008212 20210121
- 主分类号: H01F41/02
- IPC分类号: H01F41/02 ; H01F1/057 ; B29B7/88 ; B29C45/00
摘要:
A method of producing a compound for bonded magnets, the method including: heat-curing a thermosetting resin and a curing agent having a ratio of the number of reactive groups of the curing agent to the number of reactive groups of the thermosetting resin of at least 2 but not higher than 11 to obtain an additive for bonded magnets; and kneading the additive for bonded magnets, magnetic powder, and a thermoplastic resin to obtain a compound for bonded magnets in which a filling ratio of the magnetic powder is at least 91.5% by mass.
IPC结构图谱:
H | 电学 |
--H01 | 基本电气元件 |
----H01F | 磁体;电感;变压器;磁性材料的选择 |
------H01F41/00 | 专用于制造或装配包含在本小类的装置的设备或方法 |
--------H01F41/02 | .用于制造磁芯、线圈或磁体的 |