发明申请
US20220149807A1 TRANSVERSELY-EXCITED FILM BULK ACOUSTIC RESONATOR WITH LOW THERMAL IMPEDANCE
有权
基本信息:
- 专利标题： TRANSVERSELY-EXCITED FILM BULK ACOUSTIC RESONATOR WITH LOW THERMAL IMPEDANCE
- 申请号：US17217923 申请日：2021-03-30
- 公开(公告)号：US20220149807A1 公开(公告)日：2022-05-12
- 发明人： Greg Dyer , Chris O'Brien , Neal O. Fenzi , James R. Costa
- 申请人： Resonant Inc.
- 申请人地址： US CA Goleta
- 专利权人： Resonant Inc.
- 当前专利权人： Resonant Inc.
- 当前专利权人地址： US CA Goleta
- 主分类号： H03H9/02
- IPC分类号： H03H9/02 ; H03H3/02 ; H03H9/13 ; H03H9/17 ; H03H9/56
摘要：
An acoustic resonator device with low thermal impedance has a substrate and a single-crystal piezoelectric plate having a back surface attached to a top surface of the substrate via a bonding oxide (BOX) layer. An interdigital transducer (IDT) formed on the front surface of the plate has interleaved fingers disposed on the diaphragm. The piezoelectric plate and the BOX layer are removed from a least a portion of the surface area of the device to provide lower thermal resistance between the conductor pattern and the substrate.
公开/授权文献:
IPC结构图谱:
| H | 电学 |
| --H03 | 基本电子电路 |
| ----H03H | 阻抗网络，例如谐振电路；谐振器 |
| ------H03H9/00 | 包括机电或电声元件的网络，如谐振电路 |
| --------H03H9/02 | .零部件 |