基本信息:
- 专利标题： COOLANT SUPPLYING MODULE
- 申请号：US17223247 申请日：2021-04-06
- 公开(公告)号：US20220140420A1 公开(公告)日：2022-05-05
- 发明人： Yeonho Kim , Jae Yeon Kim , Jeawan Kim , Yu Man Won , Yong Hoe Jeong , Dong June Kang
- 申请人： HYUNDAI MOTOR COMPANY , KIA CORPORATION
- 申请人地址： KR Seoul; KR Seoul
- 专利权人： HYUNDAI MOTOR COMPANY,KIA CORPORATION
- 当前专利权人： HYUNDAI MOTOR COMPANY,KIA CORPORATION
- 当前专利权人地址： KR Seoul; KR Seoul
- 优先权： KR10-2020-0146708 20201105
- 主分类号： H01M10/667
- IPC分类号： H01M10/667 ; H01M10/613 ; H01M10/625 ; H01M10/63 ; H01M10/6568 ; H05K7/20
摘要：
A coolant supplying module is for supplying a coolant stored in a shared reservoir tank to an electrical component cooling circuit and a battery cooling circuit, and includes a main body connected to the shared reservoir tank, at least one valve mounting portion formed inside the main body to mount at least one valve device, at least one pump mounting portion formed inside the main body to mount at least one water pump, and a control portion mounted outside the main body and electrically connected to the at least one valve device and the at least one water pump.
IPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01M | 用于直接转变化学能为电能的方法或装置，例如电池组 |
| ------H01M10/00 | 二次电池；及其制造 |
| --------H01M10/60 | .加热或冷却；温度控制 |
| ----------H01M10/61 | ..温度控制的类型 |
| ------------H01M10/667 | ...系统为电子部件的，例如CPU、逆变器或者电容器 |