发明申请
US20220094336A1 TRANSVERSELY-EXCITED FILM BULK ACOUSTIC RESONATOR WITH MULTIPLE DIAPHRAGM THICKNESSES AND FABRICATION METHOD
有权

基本信息:
- 专利标题: TRANSVERSELY-EXCITED FILM BULK ACOUSTIC RESONATOR WITH MULTIPLE DIAPHRAGM THICKNESSES AND FABRICATION METHOD
- 申请号:US17542295 申请日:2021-12-03
- 公开(公告)号:US20220094336A1 公开(公告)日:2022-03-24
- 发明人: Chris O'Brien , Andrew Kay , Albert Cardona , Ventsislav Yantchev , Patrick Turner , Robert B. Hammond , Dylan Kelly
- 申请人: Resonant Inc.
- 申请人地址: US TX Austin
- 专利权人: Resonant Inc.
- 当前专利权人: Resonant Inc.
- 当前专利权人地址: US TX Austin
- 主分类号: H03H9/56
- IPC分类号: H03H9/56 ; H03H3/02 ; H03H3/04 ; H03H9/02 ; H03H9/17 ; H03H9/205 ; H03H9/54
摘要:
Methods of fabricating filter devices are disclosed. A back surface of a piezoelectric plate having a first thickness is attached to a substrate. The front surface of the piezoelectric plate is selectively etched to thin a portion of the piezoelectric plate from the first thickness to a second thickness less than the first thickness. Cavities are formed in the substrate such that portions of the piezoelectric plate form a plurality of diaphragms spanning respective cavities. A conductor pattern is formed on the front surface. The conductor pattern includes a first interdigital transducer (IDT) with interleaved fingers on a first diaphragm having the first thickness and a second IDT with interleaved fingers on a second diaphragm having the second thickness.
公开/授权文献:
IPC结构图谱:
H | 电学 |
--H03 | 基本电子电路 |
----H03H | 阻抗网络,例如谐振电路;谐振器 |
------H03H9/00 | 包括机电或电声元件的网络,如谐振电路 |
--------H03H9/30 | .时延网络 |
----------H03H9/48 | ..所采用的耦合装置 |
------------H03H9/56 | ...单晶滤波器 |