发明申请
US20220032402A1 Methods and systems for machining precision micro holes into thick ceramic substrates
有权
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基本信息:
- 专利标题: Methods and systems for machining precision micro holes into thick ceramic substrates
- 申请号:US17390891 申请日:2021-07-31
- 公开(公告)号:US20220032402A1 公开(公告)日:2022-02-03
- 发明人: Jens Guenter Gaebelein , Ralf Giebmanns , Jeroen Hribar
- 申请人: Avonisys AG
- 申请人地址: CH Zug
- 专利权人: Avonisys AG
- 当前专利权人: Avonisys AG
- 当前专利权人地址: CH Zug
- 主分类号: B23K26/382
- IPC分类号: B23K26/382 ; B23K26/146 ; B23K26/402
摘要:
A combination of a liquid jet and a mechanical rotary tool can be used to machine precision micro holes in thick substrates. A liquid-jet guided laser can be used to rapidly drill core holes into the ceramic substrate. A sensor can be applied to detect the cut through point of the liquid-jet guided laser drilling step to allow a rapid and closed-loop controlled machining process. The substrate can be heated up for speeding up a liquid-jet guided laser drilling process. A mechanical tool such as a drill, a reamer or a mill can be applied to finish the core holes to a desired bore diameter. The mechanical tool cutting main surface can preferably consist of a diamond material. An inspection camera and illumination system can be applied to inspect each mechanically finished bore as part of the drilling process.
IPC结构图谱:
B23K26/001 | .这个大组包括:激光加工用于制造削弱层,有或没有移除材料 |
--B23K26/352 | .用于表面处理的 |
----B23K26/362 | ..激光刻蚀 |
------B23K26/382 | ...打孔 |