发明申请
US20210394334A1 POLISHING PAD, PREPARATION METHOD THEREOF AND METHOD FOR PREPARING SEMICONDUCTOR DEVICE USING SAME
有权
基本信息:
- 专利标题： POLISHING PAD, PREPARATION METHOD THEREOF AND METHOD FOR PREPARING SEMICONDUCTOR DEVICE USING SAME
- 申请号：US17349285 申请日：2021-06-16
- 公开(公告)号：US20210394334A1 公开(公告)日：2021-12-23
- 发明人： Jae In AHN , Kyung Hwan KIM , Sung Hoon YUN , Jang Won SEO , Kang Sik MYUNG
- 申请人： SKC solmics Co., Ltd.
- 申请人地址： KR Gyeonggi-do
- 专利权人： SKC solmics Co., Ltd.
- 当前专利权人： SKC solmics Co., Ltd.
- 当前专利权人地址： KR Gyeonggi-do
- 优先权： KR10-2020-0075101 20200619,KR10-2020-0075102 20200619
- 主分类号： B24B37/24
- IPC分类号： B24B37/24 ; B24D18/00
摘要：
The embodiments relate to a polishing pad for use in a chemical mechanical planarization (CMP) process of semiconductors, to a process for preparing the same, and to a process for preparing a semiconductor device using the same. The polishing pad according to the embodiment adjusts the surface roughness characteristics of the polishing pad after polishing, whereby the polishing rate can be enhanced, and the surface residues, surface scratches, and chatter marks of the wafer can be remarkably reduced.
公开/授权文献:
IPC结构图谱:
| B | 作业；运输 |
| --B24 | 磨削；抛光 |
| ----B24B | 用于磨削或抛光的机床、装置或工艺；磨具磨损表面的修理或调节；磨削，抛光剂或研磨剂的进给 |
| ------B24B37/00 | 研磨机床或装置，即需要在相对软但仍为刚性的研具和被研磨表面之间加入粉末状磨料；及其附件 |
| --------B24B37/005 | .研磨机床或装置的控制装置 |
| ----------B24B37/12 | ..用于加工平面的研磨片 |
| ------------B24B37/24 | ...以垫的材料成分或特性为特征 |