![FILL ON DEMAND AMPOULE REFILL](/abs-image/US/2021/10/21/US20210324521A1/abs.jpg.150x150.jpg)
基本信息:
- 专利标题: FILL ON DEMAND AMPOULE REFILL
- 申请号:US17304540 申请日:2021-06-22
- 公开(公告)号:US20210324521A1 公开(公告)日:2021-10-21
- 发明人: Tuan Nguyen , Eashwar Ranganathan , Shankar Swaminathan , Adrien LaVoie , Chloe Baldasseroni , Ramesh Chandrasekharan , Frank Loren Pasquale , Jennifer Leigh Petraglia
- 申请人: Lam Research Corporation
- 申请人地址: US CA Fremont
- 专利权人: Lam Research Corporation
- 当前专利权人: Lam Research Corporation
- 当前专利权人地址: US CA Fremont
- 主分类号: C23C16/52
- IPC分类号: C23C16/52 ; C23C16/448
摘要:
Methods and apparatus for use of a fill on demand ampoule are disclosed. The fill on demand ampoule may refill an ampoule with precursor concurrent with the performance of other deposition processes. The fill on demand may keep the level of precursor within the ampoule at a relatively constant level. The level may be calculated to result in an optimum head volume. The fill on demand may also keep the precursor at a temperature near that of an optimum precursor temperature. The fill on demand may occur during parts of the deposition process where the agitation of the precursor due to the filling of the ampoule with the precursor minimally effects the substrate deposition. Substrate throughput may be increased through the use of fill on demand.
公开/授权文献:
- US11959175B2 Fill on demand ampoule refill 公开/授权日:2024-04-16