基本信息:
- 专利标题： CONDITIONING CHAMBER COMPONENT
- 申请号：US17211518 申请日：2021-03-24
- 公开(公告)号：US20210205858A1 公开(公告)日：2021-07-08
- 发明人： Amir A. YASSERI , Hong SHIH , John DAUGHERTY , Duane OUTKA , Lin XU , Armen AVOYAN , Cliff LA CROIX , Girish HUNDI
- 申请人： Lam Research Corporation
- 申请人地址： US CA Fremont
- 专利权人： Lam Research Corporation
- 当前专利权人： Lam Research Corporation
- 当前专利权人地址： US CA Fremont
- 主分类号： B08B7/04
- IPC分类号： B08B7/04 ; B08B5/02 ; B08B3/04 ; B08B3/14 ; B08B3/12
摘要：
A method for conditioning a component of a wafer processing chamber is provided. The component is placed in an ultrasonic conditioning solution in an ultrasonic solution tank. Ultrasonic energy is applied through the ultrasonic conditioning solution to the component to clean the component. The component is submerged in a megasonic conditioning solution in a tank. Megasonic energy is applied through the megasonic conditioning solution to the component to clean the component.
公开/授权文献:
- US12064795B2 Conditioning chamber component 公开/授权日：2024-08-20
IPC结构图谱:
| B | 作业；运输 |
| --B08 | 清洁 |
| ----B08B | 一般清洁；一般污垢的防除 |
| ------B08B7/00 | 不包含在其他小类或本小类的其他组中的清洁方法 |
| --------B08B7/04 | .多种操作的结合 |