基本信息:
- 专利标题： LAMINATED CIRCUITRY COOLING FOR INTER-CHIP BRIDGES
- 申请号：US16693213 申请日：2019-11-22
- 公开(公告)号：US20210159141A1 公开(公告)日：2021-05-27
- 发明人： Kamal K. Sikka , Hiroyuki Mori
- 申请人： International Business Machines Corporation
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 主分类号： H01L23/367
- IPC分类号： H01L23/367 ; H01L25/065 ; H01L23/538 ; H01L23/373 ; H01L23/498 ; H01L23/00 ; H01L23/13
摘要：
The present invention includes embodiments of a semiconductor package designed to transfer heat from one or more bridges within the package to ambient external to the package in addition to conducting the heat through any semiconductor chips encapsulated within the package. A laminated substrate has one or more horizontal layer heat conduction paths and one or more vertical substrate heat conduction paths. The vertical substrate heat conduction paths collect heat from one or more of the horizontal layer heat conduction paths, and eventually conduct the heat out of the semiconductor package, e.g. into a lid or heat sink.
公开/授权文献:
- US11101191B2 Laminated circuitry cooling for inter-chip bridges 公开/授权日：2021-08-24
IPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L23/00 | 半导体或其他固态器件的零部件 |
| --------H01L23/34 | .冷却装置；加热装置；通风装置或温度补偿装置 |
| ----------H01L23/36 | ..为便于冷却或加热对材料或造型的选择，例如散热器 |
| ------------H01L23/367 | ...为便于冷却的器件造型 |