
基本信息:
- 专利标题: Bulk Acoustic Wave Resonator with Multilayer Base
- 申请号:US17071810 申请日:2020-10-15
- 公开(公告)号:US20210111699A1 公开(公告)日:2021-04-15
- 发明人: Liping D. Hou , Alexander M. Vigo , Shing-Kuo Wang
- 申请人: Global Communication Semiconductors, LLC
- 申请人地址: US CA Torrance
- 专利权人: Global Communication Semiconductors, LLC
- 当前专利权人: Global Communication Semiconductors, LLC
- 当前专利权人地址: US CA Torrance
- 主分类号: H03H9/13
- IPC分类号: H03H9/13 ; H03H9/02 ; H03H9/17
摘要:
A bulk acoustic (BAW) resonator having a multilayer base and method of fabricating the bulk acoustic resonator is disclosed. A BAW resonator comprises a substrate having a cavity and including a frame around the cavity, a multilayer base adjacent the cavity and supported by the frame. The multilayer base includes a first layer of crystalline material having a first lattice constant and a second layer of crystalline material having a second lattice constant that is distinct from the first lattice constant. The BAW resonator further includes a stack over the multilayer base. The stack includes a first electrode formed on the multilayer base, a piezoelectric layer having a first side coupled to the first electrode and a second side opposite to the first side of the piezoelectric layer, and a second electrode coupled to the second side of the piezoelectric layer.
公开/授权文献:
- US12021498B2 Bulk acoustic wave resonator with multilayer base 公开/授权日:2024-06-25
IPC结构图谱:
H | 电学 |
--H03 | 基本电子电路 |
----H03H | 阻抗网络,例如谐振电路;谐振器 |
------H03H9/00 | 包括机电或电声元件的网络,如谐振电路 |
--------H03H9/02 | .零部件 |
----------H03H9/05 | ..支座;支承物 |
------------H03H9/13 | ...用于由压电或电致伸缩材料构成的网络 |