基本信息:
- 专利标题： CERAMIC HEATER AND METHOD OF FORMING USING TRANSIENT LIQUID PHASE BONDING
- 申请号：US17020063 申请日：2020-09-14
- 公开(公告)号：US20210084719A1 公开(公告)日：2021-03-18
- 发明人： Patrick Margavio , Todd Brooke , Kurt English
- 申请人： Watlow Electric Manufacturing Company
- 申请人地址： US MO St. Louis
- 专利权人： Watlow Electric Manufacturing Company
- 当前专利权人： Watlow Electric Manufacturing Company
- 当前专利权人地址： US MO St. Louis
- 主分类号： H05B3/28
- IPC分类号： H05B3/28 ; H05B3/12 ; H05B1/02 ; C04B37/02 ; C04B35/581
摘要：
A heater includes an aluminum nitride (AlN) substrate and a heating layer. The heating layer is made from a molybdenum material and is bonded to the AlN substrate via transient liquid phase bonding. The heater can also include a routing layer and a plurality of first conductive vias connecting the heating layer to the routing layer. The routing layer and the plurality of first conductive vias can be made from the molybdenum material and at least one of the routing layer and the plurality of first conductive vias are bonded to the AlN substrate via a transient liquid phase bond. A plurality of second conductive vias connecting the routing layer to a surface of the AlN substrate can be included and the plurality of second conductive vias are made of the molybdenum material and can be bonded to the AlN substrate via a transient liquid phase bond.
公开/授权文献:
IPC结构图谱:
| H | 电学 |
| --H05 | 其他类目不包含的电技术 |
| ----H05B | 电热；其他类目不包含的电照明 |
| ------H05B3/00 | 欧姆电阻加热的 |
| --------H05B3/02 | .零部件 |
| ----------H05B3/22 | ..不可弯曲的 |
| ------------H05B3/28 | ...加热导体嵌入绝缘材料内的 |