
基本信息:
- 专利标题: COMPOSITION CONTAINING COOLANT, HEAT TRANSFER MEDIUM AND HEAT CYCLE SYSTEM
- 申请号:US17049432 申请日:2019-04-18
- 公开(公告)号:US20210079279A1 公开(公告)日:2021-03-18
- 发明人: Kazuhiro TAKAHASHI , Shun OHKUBO , Mitsushi ITANO , Tatsuya TAKAKUWA , Kei KURAMOTO
- 申请人: DAIKIN INDUSTRIES, LTD.
- 申请人地址: JP Osaka
- 专利权人: DAIKIN INDUSTRIES, LTD.
- 当前专利权人: DAIKIN INDUSTRIES, LTD.
- 当前专利权人地址: JP Osaka
- 优先权: JP2018-084358 20180425
- 国际申请: PCT/JP2019/016616 WO 20190418
- 主分类号: C09K5/04
- IPC分类号: C09K5/04
摘要:
The present disclosure provides a composition comprising a refrigerant characterized by having a GWP lower than that of R410A and a COP equivalent to that of R410A. Specifically, the present disclosure provides a composition comprising a refrigerant, the refrigerant comprising CO2 (R744) and at least one compound A selected from the group consisting of trans-1,2-difluoroethylene [(E)-HFO-1132], cis-1,2-difluoroethylene [(Z)-HFO-1132], fluoroethylene (HFO-1141), and 3,3,3-trifluoropropyne (TFP).