发明申请
US20200224028A1 THERMOPLASTIC RESIN COMPOSITION, RESIN MOLDING, METHOD FOR MANUFACTURING PLATED RESIN MOLDING, AND METHOD FOR MANUFACTURING PORTABLE ELECTRONIC DEVICE PART
审中-公开
基本信息:
- 专利标题： THERMOPLASTIC RESIN COMPOSITION, RESIN MOLDING, METHOD FOR MANUFACTURING PLATED RESIN MOLDING, AND METHOD FOR MANUFACTURING PORTABLE ELECTRONIC DEVICE PART
- 申请号：US16648325 申请日：2018-09-28
- 公开(公告)号：US20200224028A1 公开(公告)日：2020-07-16
- 发明人： Ryusuke YAMADA , Yuki HIWATASHI
- 申请人： MITSUBISHI ENGINEERING-PLASTICS CORPORATION
- 申请人地址： JP Tokyo
- 专利权人： MITSUBISHI ENGINEERING-PLASTICS CORPORATION
- 当前专利权人： MITSUBISHI ENGINEERING-PLASTICS CORPORATION
- 当前专利权人地址： JP Tokyo
- 优先权： com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@531a020a
- 国际申请： PCT/JP2018/036254 WO 20180928
- 主分类号： C08L77/06
- IPC分类号： C08L77/06 ; C08G69/26 ; B32B15/088 ; B32B15/09 ; B32B15/20 ; H01Q1/38 ; C08L67/06
摘要：
Provided is a thermoplastic resin composition capable of yielding a resin molding well suppressed from warping after heating, while successfully maintaining high mechanical strength, and such resin molding. Provided is a thermoplastic resin composition containing LDS and capable of yielding a resin molding on which a plating layer can be formed, and, well suppressed from warping after heating while successfully maintaining high mechanical strength, such resin molding, and methods for manufacturing a plated resin molding and a portable electronic device part. The thermoplastic resin composition containing 10 to 100 parts by mass of a reinforcing filler, per 100 parts by mass of a crystalline thermoplastic resin, the reinforcing filler containing a reinforcing fiber and a glass flake having a thickness of 0.1 to 2 μm, with reinforcing fiber/glass flake, which is mass ratio of the reinforcing fiber and the glass flake, adjusted to 0.1 to 1.
IPC结构图谱:
| C | 化学；冶金 |
| --C08 | 有机高分子化合物；其制备或化学加工；以其为基料的组合物 |
| ----C08L | 高分子化合物的组合物 |
| ------C08L77/00 | 由在主链中形成羧酸酰胺键合反应得到的聚酰胺的组合物；这些聚合物的衍生物的组合物 |
| --------C08L77/06 | .由多元胺与多元羧酸得到的聚酰胺 |