基本信息:
- 专利标题： SEMICONDUCTOR WAFER
- 申请号：US16631507 申请日：2018-06-13
- 公开(公告)号：US20200176339A1 公开(公告)日：2020-06-04
- 发明人： Motohiro SUYAMA , Hironori TAKAHASHI , Tomonori NAKAMURA
- 申请人： HAMAMATSU PHOTONICS K.K.
- 申请人地址： JP Hamamatsu-shi, Shizuoka
- 专利权人： HAMAMATSU PHOTONICS K.K.
- 当前专利权人： HAMAMATSU PHOTONICS K.K.
- 当前专利权人地址： JP Hamamatsu-shi, Shizuoka
- 优先权： com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@63cffdc4
- 国际申请： PCT/JP2018/022594 WO 20180613
- 主分类号： H01L21/66
- IPC分类号： H01L21/66 ; G01R31/28 ; H01L31/08
摘要：
There is provided a semiconductor wafer suitable for the inspection of an operation state.A wafer is a semiconductor wafer having a plurality of chip forming regions, and includes a memory cell that is formed in each of the chip forming regions and an inspection device that is formed outside each of the chip forming regions. The inspection device has a photodiode that receives an input of pump light for checking an operation of the memory cell and outputs an electrical signal corresponding to the pump light and a signal processing circuit that generates a logic signal based on the electrical signal output from the photodiode and outputs the logic signal to the memory cell.
IPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L21/00 | 专门适用于制造或处理半导体或固体器件或其部件的方法或设备 |
| --------H01L21/66 | .在制造或处理过程中的测试或测量 |