基本信息:
- 专利标题： SEMICONDUCTOR STRUCTURE
- 申请号：US16679051 申请日：2019-11-08
- 公开(公告)号：US20200075516A1 公开(公告)日：2020-03-05
- 发明人： VINCENT CHEN , HUNG-YI KUO , CHUEI-TANG WANG , HAO-YI TSAI , CHEN-HUA YU , WEI-TING CHEN , MING HUNG TSENG , YEN-LIANG LIN
- 申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- 主分类号： H01L23/66
- IPC分类号： H01L23/66
摘要：
A semiconductor structure includes a transceiver, a molding surrounding the transceiver, a plurality of vias extending through the molding, and a RDL disposed over the transceiver and the plurality of vias. In some embodiments, the RDL includes an antenna disposed over and electrically connected to the transceiver, and a dielectric layer surrounding the antenna. In some embodiments, the antenna includes an elongated portion extending over the molding and a via portion electrically connected to the transceiver.
公开/授权文献:
- US10763229B2 Semiconductor structure 公开/授权日：2020-09-01
IPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L23/00 | 半导体或其他固态器件的零部件 |
| --------H01L23/552 | .防辐射保护装置，例如光 |
| ----------H01L23/64 | ..阻抗装置 |
| ------------H01L23/66 | ...高频匹配器 |