A thermoforming apparatus is provided having a frame, a pair of platens, and a platen drive assembly. The platens are carried by the frame on opposite sides of a sheet line each configured to carry a respective die. One platen has a proximal die surface adjacent the sheet line and a rear surface distal the sheet line. The platen drive assembly is interposed between the frame and the one platen and has at least one reciprocating kinematic linkage and a drive motor configured to reciprocate the one platen to and fro relative to another platen. The kinematic linkage has a plurality of links interconnected pivotally together with respective rotation joints and interposed between the frame and the one platen. An outboard-most rotation joint is provided proximate one end of the frame and an inboard-most rotation joint intermediate the rear surface and the proximal die surface. A method is also provided.