基本信息:
- 专利标题： HIGH-SPEED INTERCONNECTS FOR PRINTED CIRCUIT BOARDS
- 申请号：US16031748 申请日：2018-07-10
- 公开(公告)号：US20180332720A1 公开(公告)日：2018-11-15
- 发明人： Arthur E. Harkness, JR. , Eva M. Kenny-McDermott , Paul W. Farineau , Raymond A. Lavallee , Michael Fancher
- 申请人： Amphenol Corporation
- 申请人地址： US CT Wallingford
- 专利权人： Amphenol Corporation
- 当前专利权人： Amphenol Corporation
- 当前专利权人地址： US CT Wallingford
- 主分类号： H05K3/46
- IPC分类号： H05K3/46 ; H05K3/22 ; H05K3/38 ; H05K1/02 ; H05K1/11 ; H05K3/00 ; H05K1/09 ; H05K1/03 ; H05K3/20
摘要：
High-speed interconnects for printed circuit boards and methods for forming the high-speed interconnects are described. A high-speed interconnect may comprise a region of a conductive film having a reduced surface roughness and one or more regions that have been treated for improved bonding with an adjacent insulating layer. Regions of reduced roughness may be used to carry high data rate signals within PCBs. Regions treated for bonding may include a roughened surface, adhesion-promoting chemical treatment, and/or material deposited to improve wettability of the surface and/or adhesion to a cured insulator.
公开/授权文献:
- US10993331B2 High-speed interconnects for printed circuit boards 公开/授权日：2021-04-27
IPC结构图谱:
| H | 电学 |
| --H05 | 其他类目不包含的电技术 |
| ----H05K | 印刷电路；电设备的外壳或结构零部件；电气元件组件的制造 |
| ------H05K3/00 | 用于制造印刷电路的设备或方法 |
| --------H05K3/46 | .多层电路的制造 |