基本信息:
- 专利标题： SEMI-CONDUCTOR PACKAGE STRUCTURE
- 申请号：US16034917 申请日：2018-07-13
- 公开(公告)号：US20180323164A1 公开(公告)日：2018-11-08
- 发明人： Xinhua Wang
- 申请人： Intel Corporation
- 优先权： CN201510378948.5 20150701
- 主分类号： H01L23/00
- IPC分类号： H01L23/00 ; H01L23/498
摘要：
Disclosed is a semiconductor package structure comprising a body, a plurality of first-layer, second-layer, third-layer and fourth-layer electrical contacts, wherein the first-layer, the second-layer, the third-layer and the fourth-layer electrical contacts are arranged sequentially from outside, to inside on a bottom surface of the body in a matrix manner. Adjacent first-layer electrical contacts have two different spacings therein, and adjacent third-layer electrical contacts have the two different spacings therein.
公开/授权文献:
- US10490522B2 Semi-conductor package structure 公开/授权日：2019-11-26
IPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L23/00 | 半导体或其他固态器件的零部件 |