![HEAT DISSIPATION DEVICE FOR AN ELECTRONIC DEVICE](/abs-image/US/2018/10/04/US20180288873A1/abs.jpg.150x150.jpg)
基本信息:
- 专利标题: HEAT DISSIPATION DEVICE FOR AN ELECTRONIC DEVICE
- 申请号:US15920806 申请日:2018-03-14
- 公开(公告)号:US20180288873A1 公开(公告)日:2018-10-04
- 发明人: Matthias Rieke , Volker Klink , Florin Badarau-Trescovan
- 申请人: Delphi International Operations Luxembourg, S.A.R.L.
- 优先权: FR1752778 20170331
- 主分类号: H05K1/14
- IPC分类号: H05K1/14 ; H05K7/20 ; H05K5/02 ; H05K1/02 ; H05K7/14
摘要:
An electronic device for a motor vehicle includes a metal tubular casing extending longitudinally and opening at its two ends, and a wall having a curved profile with cooling fins on its outer surface. The electronic device includes an assembly of printed circuit boards comprising a first plurality of printed circuit boards that include heat-generating electronic components. The printed circuit boards of the assembly are connected together by flexible conductive elements. The device further comprises a first heat sink arranged inside the tubular casing comprising a curved wall generally extending parallel to the curved wall of the tubular casing. The first plurality of printed circuit boards is interposed between the curved inner surface of the wall of the casing and the curved wall of the first heat sink so heat is dissipated through the first heat sink and through the curved wall equipped with cooling fins of the tubular casing.
公开/授权文献:
- US10212816B2 Heat dissipation device for an electronic device 公开/授权日:2019-02-19
IPC结构图谱:
H | 电学 |
--H05 | 其他类目不包含的电技术 |
----H05K | 印刷电路;电设备的外壳或结构零部件;电气元件组件的制造 |
------H05K1/00 | 印刷电路 |
--------H05K1/02 | .零部件 |
----------H05K1/14 | ..两个或更多个印刷电路的结构连接 |