基本信息:
- 专利标题： ADHESIVES COMPRISING POLYINDANE RESINS
- 申请号：US15845222 申请日：2017-12-18
- 公开(公告)号：US20180171189A1 公开(公告)日：2018-06-21
- 发明人： Mark William Ingratta , Soumendra Kumar Basu , Mark Stanley Pavlin , Joseph Alexander Deloach , George Joseph Kutsek , Wei Min Cheng , Terri Roxanne Carvagno , Christopher Lee Lester
- 申请人： Eastman Chemical Company
- 申请人地址： US TN Kingsport
- 专利权人： Eastman Chemical Company
- 当前专利权人： Eastman Chemical Company
- 当前专利权人地址： US TN Kingsport
- 主分类号： C09J125/08
- IPC分类号： C09J125/08 ; C08L53/00
摘要：
The present invention is generally related to various types of compositions that comprise a polyindane resin. In particular, the polyindane resins may be utilized in various polymer-based and elastomer-based formulations in order to enhance several properties and characteristics of those formulations. More specifically, adhesive formulations are provided that comprise at least one polyindane resin, which may be used to replace or enhance the functionality of existing hydrocarbon resins typically used in adhesive formulations. Compositions comprising at least one thermoplastic elastomer and at least one polyindane resin are also provided.
公开/授权文献:
- US10851270B2 Adhesives comprising polyindane resins 公开/授权日：2020-12-01