发明申请
US20180106765A1 ULTRASONIC INSPECTION TECHNIQUE TO ASSESS BOND QUALITY IN COMPOSITE STRUCTURES
审中-公开
基本信息:
- 专利标题： ULTRASONIC INSPECTION TECHNIQUE TO ASSESS BOND QUALITY IN COMPOSITE STRUCTURES
- 申请号：US15296958 申请日：2016-10-18
- 公开(公告)号：US20180106765A1 公开(公告)日：2018-04-19
- 发明人： Yong Min Kim , Joseph T. Case , Shant Kenderian
- 申请人： The Aerospace Corporation
- 专利权人： The Aerospace Corporation
- 当前专利权人： The Aerospace Corporation
- 主分类号： G01N29/06
- IPC分类号： G01N29/06 ; G01N29/07 ; G01N29/48 ; G01N29/44
摘要：
An ultrasonic inspection technique may be used to inspect quality of a bond between thermal protection system (TPS) material and a composite. The technique may include a highly damped transducer emitting an incident wave, which may traverse through thermal protection system (TPS) material and to a back wall of a composite. The incident wave may be of a low frequency signal, and may return a bondline echo and a backwall echo. The bondline echo is returned when the incident wave reaches a bondline and the backwall echo is returned when the incident wave reaches the backwall of the composite. The bondline echo and the backwall echo may be used to generate a waveform to assess the bond quality, revealing possible unbonds or kissing unbonds.
公开/授权文献:
IPC结构图谱:
| G | 物理 |
| --G01 | 测量；测试 |
| ----G01N | 借助于测定材料的化学或物理性质来测试或分析材料 |
| ------G01N29/00 | 利用超声波、声波或次声波来测试或分析材料；靠发射超声波或声波通过物体得到物体内部的显像 |
| --------G01N29/02 | .流体分析 |
| ----------G01N29/06 | ..内部的显像，例如，声显微技术 |