基本信息:
- 专利标题： Package-On-Package (PoP) Structure Including Stud Bulbs
- 申请号：US15793325 申请日：2017-10-25
- 公开(公告)号：US20180047709A1 公开(公告)日：2018-02-15
- 发明人： Chen-Hua Yu , Mirng-Ji Lii , Chung-Shi Liu , Ming-Da Cheng
- 申请人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 主分类号： H01L25/065
- IPC分类号： H01L25/065 ; H01L23/498 ; H01L25/00 ; H01L23/00 ; H01L25/10
摘要：
Embodiments concern Package-On-Package (PoP) structures including stud bulbs and methods of forming PoP structures. According to an embodiment, a structure includes a first substrate, stud bulbs, a die, a second substrate, and electrical connectors. The stud bulbs are coupled to a first surface of the first substrate. The die is attached to the first surface of the first substrate. The electrical connectors are coupled to the second substrate, and respective ones of the electrical connectors are coupled to respective ones of the stud bulbs.
公开/授权文献:
- US10157893B2 Package-on-package (PoP) structure including stud bulbs 公开/授权日：2018-12-18
IPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L25/00 | 由多个单个半导体或其他固态器件组成的组装件 |
| --------H01L25/03 | .所有包含在H01L27/00至H01L51/00各组中同一小组内的相同类型的器件，例如整流二极管的组装件 |
| ----------H01L25/04 | ..不具有单独容器的器件 |
| ------------H01L25/065 | ...包含在H01L27/00组类型的器件 |