The invention relates to a chip arrangement (10) and to a method for forming a contact connection (11) between a chip (18), in particular a power transistor or the like, and a conductor material track (14), the conductor material track being formed on a non-conductive substrate (12), the chip being arranged on the substrate or on a conductor material track (15), a silver paste (29) or a copper paste being applied to each of a chip contact surface (25) of the chip and the conductor material track (28), a contact conductor (30) being immersed into the silver paste or the copper paste on the chip contact surface and into the silver paste or the copper paste on the conductor material track, a solvent contained in the silver paste or the copper paste being at least partially vaporized by heating and the contact connection being formed by sintering the silver paste or the copper paste by means of laser energy.