发明申请
US20180011402A1 RESIN, PHOTOSENSITIVE RESIN COMPOSITION, ELECTRONIC COMPONENT AND DISPLAY DEVICE USING THE SAME
审中-公开
基本信息:
- 专利标题： RESIN, PHOTOSENSITIVE RESIN COMPOSITION, ELECTRONIC COMPONENT AND DISPLAY DEVICE USING THE SAME
- 申请号：US15545912 申请日：2016-01-25
- 公开(公告)号：US20180011402A1 公开(公告)日：2018-01-11
- 发明人： Tomoyuki YUBA , Yuki MASUDA , Jiake JIN , Ping LI
- 申请人： TORAY INDUSTRIES, INC.
- 申请人地址： JP Tokyo
- 专利权人： TORAY INDUSTRIES, INC.
- 当前专利权人： TORAY INDUSTRIES, INC.
- 当前专利权人地址： JP Tokyo
- 优先权： JP2015-012924 20150127; CN201510134502.8 20150326; CN201510134581.2 20150326
- 国际申请： PCT/JP2016/052016 WO 20160125
- 主分类号： G03F7/023
- IPC分类号： G03F7/023 ; G03F7/16 ; H01L27/12 ; H01L23/31 ; H01L23/29 ; G03F7/40 ; G03F7/32 ; G03F7/20 ; C07C25/18 ; C08G73/22 ; C08G73/10 ; C07D263/56 ; C07C231/02 ; C07C215/80 ; C07C209/74 ; H05K1/02 ; H01L27/32
摘要：
A resin having a small linear thermal expansion coefficient and a low absorbance is provided. The resin is characterized by including at least one structure selected from structures represented by the following general formulae (1) and (2):