基本信息:
- 专利标题： SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE THEREOF
- 申请号：US15194170 申请日：2016-06-27
- 公开(公告)号：US20170373050A1 公开(公告)日：2017-12-28
- 发明人： Tung-Liang Shao , Yi-Li Hsiao , Hsiao-Yun Chen , Chih-Hang Tung , Chen-Hua Yu
- 申请人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 主分类号： H01L25/00
- IPC分类号： H01L25/00 ; H01L25/065 ; H01L23/00 ; H01L21/56 ; H01L21/78 ; H01L23/498
摘要：
Semiconductor devices and methods of manufacture thereof are disclosed. In some embodiments, a method of manufacturing a device includes coupling a first semiconductor device to a second semiconductor device by spacers. The first semiconductor device has first contact pads disposed thereon, and the second semiconductor device has second contact pads disposed thereon. The method includes forming an immersion interconnection between the first contact pads of the first semiconductor device and the second contact pads of the second semiconductor device.
公开/授权文献:
IPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L25/00 | 由多个单个半导体或其他固态器件组成的组装件 |