![HONEYCOMB ASSEMBLY AND PACKAGING SYSTEM](/abs-image/US/2017/12/28/US20170369218A1/abs.jpg.150x150.jpg)
基本信息:
- 专利标题: HONEYCOMB ASSEMBLY AND PACKAGING SYSTEM
- 申请号:US15700687 申请日:2017-09-11
- 公开(公告)号:US20170369218A1 公开(公告)日:2017-12-28
- 发明人: Dana Craig Bookbinder , Thomas Richard Chapman , Pushkar John Tandon , Christopher John Warren
- 申请人: Corning Incorporated
- 主分类号: B65D77/02
- IPC分类号: B65D77/02 ; B01D46/24 ; C04B111/32
摘要:
A packaging system for honeycomb assemblies, each including a honeycomb body and reinforcing tube held together by an interference fit or axial compression achieved by thermal expansion coefficient differences between the honeycomb body and reinforcing tube. The reinforcing tube then protects the honeycomb body, facilitating a compact and structurally-strong package.
公开/授权文献:
- US10017311B2 Honeycomb assembly and packaging system 公开/授权日:2018-07-10