基本信息:
- 专利标题： SUPPORT STRUCTURE AND MANUFACTURE METHOD THEREOF
- 申请号：US15435320 申请日：2017-02-17
- 公开(公告)号：US20170332490A1 公开(公告)日：2017-11-16
- 发明人： Yung-Tai SU , Ching-Fang CHENG , Ti-Chiang CHIU
- 申请人： CHUNGHWA PRECISION TEST TECH. CO., LTD.
- 申请人地址： TW TAOYUAN CITY
- 专利权人： CHUNGHWA PRECISION TEST TECH. CO., LTD.
- 当前专利权人： CHUNGHWA PRECISION TEST TECH. CO., LTD.
- 当前专利权人地址： TW TAOYUAN CITY
- 优先权： TW105115094 20160516
- 主分类号： H05K1/11
- IPC分类号： H05K1/11 ; H05K3/34 ; H05K3/40 ; H05K1/09
摘要：
A support structure located at a bottom of a ball grid array (BGA) is provided. The support structure includes a printed circuit board (PCB) having first positioning pin holes, an interface plate having second positioning pin holes which correspond to the first positioning pin holes arranged on the PCB, a support film arranged on the PCB and having support portions, and positioning components penetrating the first positioning pin holes and the second positioning pin holes corresponding to the first positioning pin holes to assemble the support film on the PCB and the interface plate.
公开/授权文献:
- US10021783B2 Support structure and manufacture method thereof 公开/授权日：2018-07-10
IPC结构图谱:
| H | 电学 |
| --H05 | 其他类目不包含的电技术 |
| ----H05K | 印刷电路；电设备的外壳或结构零部件；电气元件组件的制造 |
| ------H05K1/00 | 印刷电路 |
| --------H05K1/02 | .零部件 |
| ----------H05K1/11 | ..对印刷电路或印刷电路之间提供电连接的印刷元件 |