发明申请
US20170332487A1 RESIN COMPOSITION FOR PRINTED WIRING BOARD, PREPREG, METAL FOIL-CLAD LAMINATE, RESIN SHEET, AND PRINTED WIRING BOARD
有权
基本信息:
- 专利标题： RESIN COMPOSITION FOR PRINTED WIRING BOARD, PREPREG, METAL FOIL-CLAD LAMINATE, RESIN SHEET, AND PRINTED WIRING BOARD
- 申请号：US15525442 申请日：2016-01-29
- 公开(公告)号：US20170332487A1 公开(公告)日：2017-11-16
- 发明人： Takashi KOBAYASHI , Kentaro TAKANO
- 申请人： MITSUBISHI GAS CHEMICAL COMPANY, INC.
- 申请人地址： JP Tokyo
- 专利权人： MITSUBISHI GAS CHEMICAL COMPANY, INC.
- 当前专利权人： MITSUBISHI GAS CHEMICAL COMPANY, INC.
- 当前专利权人地址： JP Tokyo
- 优先权： JP2015-016460 20150130
- 国际申请： PCT/JP2016/052737 WO 20160129
- 主分类号： H05K1/03
- IPC分类号： H05K1/03 ; C08G8/28 ; B32B15/092 ; C08G59/40 ; C08K3/36 ; C08J5/24
摘要：
The present invention provides a resin composition for a printed wiring board comprising a cyanate compound (A) represented by following general formula (1): wherein n represents an integer of 1 or more; and an epoxy resin (B).