发明申请
US20170325329A1 PACKAGED SEMICONDUCTOR DEVICE HAVING A SHIELDING AGAINST ELECTROMAGNETIC INTERFERENCE AND MANUFACTURING PROCESS THEREOF
审中-公开
基本信息:
- 专利标题： PACKAGED SEMICONDUCTOR DEVICE HAVING A SHIELDING AGAINST ELECTROMAGNETIC INTERFERENCE AND MANUFACTURING PROCESS THEREOF
- 申请号：US15658165 申请日：2017-07-24
- 公开(公告)号：US20170325329A1 公开(公告)日：2017-11-09
- 发明人： Federico Giovanni Ziglioli
- 申请人： STMICROELECTRONICS S.R.L.
- 优先权： ITTO2014A000076 20140131
- 主分类号： H05K1/02
- IPC分类号： H05K1/02 ; H05K7/02 ; H01L23/552 ; H01L23/00 ; H01L23/13 ; H01L23/31 ; H01L21/56
摘要：
A packaged device has a die of semiconductor material bonded to a support. An electromagnetic shielding structure surrounds the die and is formed by a grid structure of conductive material extending into the support and an electromagnetic shield, coupled together. A packaging mass embeds both the die and the electromagnetic shield. The electromagnetic shield is formed by a plurality of metal ribbon sections overlying the die and embedded in the packaging mass. Each metal ribbon section has a thickness-to-width ratio between approximately 1:2 and approximately 1:50.
公开/授权文献:
IPC结构图谱:
| H | 电学 |
| --H05 | 其他类目不包含的电技术 |
| ----H05K | 印刷电路；电设备的外壳或结构零部件；电气元件组件的制造 |
| ------H05K1/00 | 印刷电路 |
| --------H05K1/02 | .零部件 |