发明申请
US20170271219A1 SCANNING ACOUSTIC MICROSCOPE SENSOR ARRAY FOR CHIP-PACKAGING INTERACTION PACKAGE RELIABILITY MONITORING
有权
基本信息:
- 专利标题： SCANNING ACOUSTIC MICROSCOPE SENSOR ARRAY FOR CHIP-PACKAGING INTERACTION PACKAGE RELIABILITY MONITORING
- 申请号：US15615148 申请日：2017-06-06
- 公开(公告)号：US20170271219A1 公开(公告)日：2017-09-21
- 发明人： Taryn J. Davis , Jonathan R. Fry , Tuhin Sinha
- 申请人： International Business Machines Corporation
- 主分类号： H01L21/66
- IPC分类号： H01L21/66 ; H01L23/498 ; G01N29/06 ; H01L21/56 ; H01L21/48
摘要：
A method includes forming a flip-chip module including a chip connected to a substrate with a layer of underfill material adhered to the chip and the substrate; sensing chip-packaging interaction failure in the underfilled flip-chip module in situ; reporting in-situ chip-packaging interaction failure to a device in real-time; and imaging the chip-packaging interaction failure with an indirect scanning acoustic microscope.
公开/授权文献:
IPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L21/00 | 专门适用于制造或处理半导体或固体器件或其部件的方法或设备 |
| --------H01L21/66 | .在制造或处理过程中的测试或测量 |