基本信息:
- 专利标题： CIRCUIT ASSEMBLY
- 申请号：US15326870 申请日：2015-07-01
- 公开(公告)号：US20170202088A1 公开(公告)日：2017-07-13
- 发明人： Arinobu Nakamura
- 申请人： AutoNetworks Technologies, Ltd. , Sumitomo Wiring Systems, Ltd , Sumitomo Electric Industries, Ltd.
- 申请人地址： JP Yokkaichi, Mie JP Yokkaichi, Mie JP Osaka-shi, Osaka
- 专利权人： AutoNetworks Technologies, Ltd.,Sumitomo Wiring Systems, Ltd,Sumitomo Electric Industries, Ltd.
- 当前专利权人： AutoNetworks Technologies, Ltd.,Sumitomo Wiring Systems, Ltd,Sumitomo Electric Industries, Ltd.
- 当前专利权人地址： JP Yokkaichi, Mie JP Yokkaichi, Mie JP Osaka-shi, Osaka
- 优先权： JP2014-148721 20140722
- 国际申请： PCT/JP2015/069019 WO 20150701
- 主分类号： H05K1/18
- IPC分类号： H05K1/18 ; H05K1/11
摘要：
Provided is a circuit assembly that does not require e.g. bending of a terminal of an electronic component. A circuit assembly includes an electronic component that is to be mounted is connected to a conductive member through a first opening in a state in which its main body is disposed on one side of a substrate covering at least a part of the first opening formed in the substrate, and a first terminal is connected to a conductive pattern (a land) of the substrate, and a second terminal is connected to the conductive member through a second opening formed in the substrate.
公开/授权文献:
- US09974182B2 Circuit assembly 公开/授权日：2018-05-15
IPC结构图谱:
| H | 电学 |
| --H05 | 其他类目不包含的电技术 |
| ----H05K | 印刷电路；电设备的外壳或结构零部件；电气元件组件的制造 |
| ------H05K1/00 | 印刷电路 |
| --------H05K1/18 | .在结构上与非印制电元件相联接的印刷电路 |