
基本信息:
- 专利标题: MODULAR THERMAL ISOLATION BARRIER FOR DATA PROCESSING EQUIPMENT STRUCTURE
- 申请号:US15424804 申请日:2017-02-04
- 公开(公告)号:US20170150652A1 公开(公告)日:2017-05-25
- 发明人: Joshua Blaine GREESON , Steven J. GIBBLE , Joshua James YOUNG , Jared Keith DAVIS
- 申请人: CHATSWORTH PRODUCTS, INC.
- 主分类号: H05K7/20
- IPC分类号: H05K7/20 ; H05K7/18 ; E04B1/19 ; A47B96/20 ; A47B96/14 ; E04B1/66 ; H05K7/14 ; A47B47/00
摘要:
A modular thermal isolation barrier for use in sealing gaps in a data processing equipment structure includes an extruded edge seal and a panel. The extruded edge seal has a seal portion and a base portion with one or more channels. An edge of the panel is disposed within one of the one or more channels of the base portion of the edge seal such that the edge seal is seated against the edge of the panel with the seal portion in position to abut, and establish a seal with, an adjacent structure.
公开/授权文献:
IPC结构图谱:
H | 电学 |
--H05 | 其他类目不包含的电技术 |
----H05K | 印刷电路;电设备的外壳或结构零部件;电气元件组件的制造 |
------H05K7/00 | 对各种不同类型电设备通用的结构零部件 |
--------H05K7/20 | .便于冷却、通风或加热的改进 |