发明申请
US20170101532A1 CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF, SEMICONDUCTOR ENCAPSULATING MATERIAL, SEMICONDUCTOR DEVICE, PREPREG, CIRCUIT BOARD, BUILD-UP FILM, BUILD-UP SUBSTRATE, FIBER-REINFORCED COMPOSITE MATERIAL, AND FIBER-REINFORCED RESIN MOLDED PRODUCT
审中-公开
基本信息:
- 专利标题： CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF, SEMICONDUCTOR ENCAPSULATING MATERIAL, SEMICONDUCTOR DEVICE, PREPREG, CIRCUIT BOARD, BUILD-UP FILM, BUILD-UP SUBSTRATE, FIBER-REINFORCED COMPOSITE MATERIAL, AND FIBER-REINFORCED RESIN MOLDED PRODUCT
- 申请号：US15315840 申请日：2015-02-19
- 公开(公告)号：US20170101532A1 公开(公告)日：2017-04-13
- 发明人： Tomohiro Shimono , Kazuo Arita
- 申请人： DIC Corporation
- 优先权： JP2014-122402 20140613
- 国际申请： PCT/JP2015/054593 WO 20150219
- 主分类号： C08L79/04
- IPC分类号： C08L79/04 ; C08G73/06 ; C08J5/24
摘要：
The present invention provides a curable resin composition having excellent fluidity and giving a cured product having excellent physical properties such as heat resistance, moisture resistance/solder resistance, flame retardance, and dielectric characteristics. The curable resin composition contains a resin (A) which has a benzoxazine structure represented by structural formula (A1) below and an epoxy resin (B) at such a ratio that when the total number of moles of the benzoxazine structure of the structural formula (A1) is α, and the number of moles of epoxy groups in the epoxy resin (B) is β, a ratio [β/α] is 0.1 to 0.5.