基本信息:
- 专利标题： SURFACE-MOUNT ELECTRONIC COMPONENT
- 申请号：US15367364 申请日：2016-12-02
- 公开(公告)号：US20170084482A1 公开(公告)日：2017-03-23
- 发明人： Olivier Ory
- 申请人： STMicroelectronics (Tours) SAS
- 申请人地址： FR Tours
- 专利权人： STMicroelectronics (Tours) SAS
- 当前专利权人： STMicroelectronics (Tours) SAS
- 当前专利权人地址： FR Tours
- 优先权： FR1558067 20150831
- 主分类号： H01L21/768
- IPC分类号： H01L21/768 ; H01L23/538 ; H01L21/3065
摘要：
A surface-mount chip is formed by a silicon substrate having a front surface and a side. The chip includes a metallization intended to be soldered to an external device. The metallization has a first portion covering at least a portion of the front surface of the substrate and a second portion covering at least a portion of the side of the substrate. A porous silicon region is included in the substrate to separating the second portion of the metallization from the rest of the substrate.
IPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L21/00 | 专门适用于制造或处理半导体或固体器件或其部件的方法或设备 |
| --------H01L21/67 | .专门适用于在制造或处理过程中处理半导体或电固体器件的装置；专门适合于在半导体或电固体器件或部件的制造或处理过程中处理晶片的装置 |
| ----------H01L21/71 | ..限定在组H01L21/70中的器件的特殊部件的制造 |
| ------------H01L21/768 | ...利用互连在器件中的分离元件间传输电流 |