发明申请
US20160355680A1 METHOD OF MANUFACTURING COMPOSITION FOR PREPARING POLYETHERIMIDE/POLYESTER BLEND CHIP
审中-公开
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基本信息:
- 专利标题: METHOD OF MANUFACTURING COMPOSITION FOR PREPARING POLYETHERIMIDE/POLYESTER BLEND CHIP
- 专利标题(中):制备聚乙二醇/聚酯混合胶的组合物的制备方法
- 申请号:US15239975 申请日:2016-08-18
- 公开(公告)号:US20160355680A1 公开(公告)日:2016-12-08
- 发明人: Lung-Chang Hung , Sheng-Shan Chang , Nai-Yun Liang , Chun-Hung Lin
- 申请人: TAIWAN TEXTILE RESEARCH INSTITUTE
- 优先权: TW103141625 20141201
- 主分类号: C08L79/08
- IPC分类号: C08L79/08 ; G02B6/38 ; C08J3/12
摘要:
A method for preparing a polyetherimide/polyester blend chip includes providing a composition. The composition includes a polyetherimide powder and a polyester powder. The polyetherimide powder has a variable diameter in a range of 10 μm to 600 μm. The polyester powder has a variable diameter in a range of 10 μm to 600 μm and a limiting viscosity in a range of 0.85 dl/g to 1.10 dl/g. Then, performing a powder dispersion treatment on the composition. The composition undergoes melt compounding after performing the powder dispersion treatment. The composition is next pelletizing melt compounding.
摘要(中):
制备聚醚酰亚胺/聚酯共混物芯片的方法包括提供组合物。 该组合物包括聚醚酰亚胺粉末和聚酯粉末。 聚醚酰亚胺粉末的直径可变为10μm〜600μm。 该聚酯粉末的直径可变的范围为10μm〜600μm,特性粘度为0.85dl / g〜1.10dl / g。 然后,对组合物进行粉末分散处理。 在进行粉末分散处理后,组合物进行熔融混合。 该组合物是接下来的造粒熔融配混。