发明申请
US20160035593A1 DEVICES AND METHODS RELATED TO SUPPORT FOR PACKAGING SUBSTRATE PANEL HAVING CAVITIES
审中-公开
基本信息:
- 专利标题： DEVICES AND METHODS RELATED TO SUPPORT FOR PACKAGING SUBSTRATE PANEL HAVING CAVITIES
- 专利标题（中）：用于包装具有CAVITIES的基板的相关装置和方法
- 申请号：US14809239 申请日：2015-07-26
- 公开(公告)号：US20160035593A1 公开(公告)日：2016-02-04
- 发明人： Matthew Sean READ , Howard E. CHEN , Sandra Louise PETTY-WEEKS
- 申请人： SKYWORKS SOLUTIONS, INC.
- 主分类号： H01L21/56
- IPC分类号： H01L21/56 ; B29C43/36 ; B29C43/18
摘要：
Devices and methods related to support for packaging substrate panel having cavities. In some embodiments, a device for fabricating radio-frequency (RF) modules can include a support plate having a receiving side configured to receive a packaging substrate panel having a plurality of pockets. The receiving side can include a plurality of support features. Each support feature can be dimensioned to fit at least partially into the corresponding pocket and provide support for a portion of the packaging substrate panel associated with the pocket. Among others, such a device can allow formation of an overmold on the side of packaging substrate panel opposite from the pockets, without mechanical deformation of the packaging substrate panel.
摘要（中）：
与支撑具有空腔的包装衬底面板相关的装置和方法。 在一些实施例中，用于制造射频（RF）模块的装置可以包括支撑板，其具有被配置为接收具有多个袋的封装衬底面板的接收侧。 接收侧可以包括多个支撑特征。 每个支撑特征的尺寸可以至少部分地配合到相应的袋中，并且为与袋相关联的一部分包装衬底面板提供支撑。 其中，这种装置可以允许在包装基板的与袋口相对的一侧上形成包覆模制，而不会使包装基板面板发生机械变形。
IPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L21/00 | 专门适用于制造或处理半导体或固体器件或其部件的方法或设备 |
| --------H01L21/02 | .半导体器件或其部件的制造或处理 |
| ----------H01L21/027 | ..未在H01L21/18或H01L21/34组中包含的为进一步的光刻工艺在半导体之上制作掩膜 |
| ------------H01L21/50 | ...应用H01L21/06至H01L21/326中的任一小组都不包含的方法或设备组装半导体器件的 |
| --------------H01L21/56 | ....封装，例如密封层、涂层 |